Hiroshima University (Japan) and the University of Idaho (US) have officially launched a joint international initiative to train semiconductor engineers, with Vietnam expected to contribute the largest number of students to the programme.

Vietnamese Consul General in Fukuoka Vu Chi Mai (6th from right, first row) poses for a group photo with leaders of two universities at the event.

The initiative, titled the Microchips Engineering and Security Alliance (MESA), aims to cultivate a high-quality workforce in the fields of microchip engineering and semiconductor security.

It will deliver an intensive curriculum covering chip design, production, and cybersecurity, in response to the growing global demand for skilled professionals in the semiconductor industry.

The MESA also seeks to strengthen knowledge and technology exchange among participating countries, including Japan, the US, Vietnam, and others, through close cooperation between academic institutions and industry partners.

The MESA is a four-year, English-language degree programme, with students spending the first two years at Hiroshima University and the final two at the University of Idaho.

Graduates will be awarded a degree by the University of Idaho and will receive internationally recognised advanced certifications, equipping them to work at leading semiconductor companies worldwide. The inaugural cohort is expected to begin in October next year.

The programme aims to enrol at least 100 students annually, with plans to expand in line with rising demand from the semiconductor industries in the US, Japan, Vietnam, and Taiwan (China).

Speaking at the launch ceremony, Vietnamese Consul General in Fukuoka Vu Chi Mai pledged support from the Consulate General and the Vietnam–Japan Experts’ Society (VJS) to promote the programme among Vietnamese students as early as possible.

She also urged both universities to offer concrete incentives, including scholarships and job placement opportunities, with leading semiconductor firms in Vietnam, Japan, and the US.

Mai reaffirmed the Vietnamese Government’s strong commitment to attracting semiconductor investment and providing favourable conditions for companies operating in the sector.

She called on participating firms to clearly define their recruitment needs for programme graduates and to contribute more significantly in terms of financial and technical support, including the provision of advanced equipment for the training initiative.

Professor Dean Kahler, Vice Provost for Academic Affairs at the University of Idaho, expressed confidence in the university’s capacity to train up to 500, or even 1,000 students annually.

While Vietnamese students are seen as key participants, the programme is also open to candidates from other countries, he said, elaborating that Indonesia’s Ministry of Education has already pledged five initial scholarships for Indonesian students joining the MESA initiative.

Earlier, in late April, Professor Mitsuo Ochi, President of Hiroshima University, and Vu Quoc Huy, Director of Vietnam’s National Innovation Centre (NIC), signed a Memorandum of Understanding (MoU) on training cooperation.

Under the agreement, NIC will offer 20 annual scholarships to support Vietnamese students enrolling in the MESA programme.

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